Wafer Flatness Measurement System

  • Product No:UltraMap C200L
  • Manufacturer:MicroSense, LLC
  • Reduce 200mm wafer measurement time – industry leading 1.25x higher throughput – 56 wafers per hour in E++ equivalent mode, with full wafer mapping and 2mm edge exclusion

  • 90+ wafers per hour in E emulation mode, with 3mm edge exclusion

  • Nanometer resolution, dual probe MicroSense capacitive measurement system for high sensitivity and high repeatability measurements in compliance with SEMI standards

  • Measures over 200,000 data points per 200mm wafer

  • Fully automated in machine Auto-Calibration – more wafers measured each shift

  • Designed for reliability and long term support - UltraMap has a modern, high reliability system design with direct drive precision air bearing r-theta wafer stage and software running on Windows computer.

  • Non-contact 200 mm precision air bearing r-theta stage

  • Dual arm Robot and pre-aligner

  • Kinematic 3 point wafer holder

  • Cassette sorting; 5 cassettes (2 in, 3 out)

  • Integrated light curtain safety system

  • Optional SECS/GEM interface

  • Optional Resistivity, Low or High or both

  • Optional P/N type sensor

  • Dual sided SEMI standard capacitance measurement

  • 2mm edge exclusion

  • Completely programmable measurement path, including legacy system emulation. 1.9mm standard measurement ring spacing.


AccuracyRepeatability (1 sigma)Absolute Range

Thickness

±0.25 μm0.06 μmNominal ±150 μm
Global Flatness±0.06 μm0.02 μm
Site Flatness±0.06 μm90% of sites: 0.011 μm


10% of sites: 0.025 μm
Shape (Bow/Warp)±(1.5 + 3% of reading) μm±(0.5 + 1% of reading) μm±150 μm

Wafer   Properties

Material

Silicon wafer - etched,   lapped or polished

Wafer diameters

200mm diameter (option   for 150mm)

Wafer thickness

300μm to 1200μm

Notches, Flats   (Primary/Secondary

Up to 2 notch or flat   per SEMI standard

Edge Exclusion

Adjustable; up to 2mm   from wafer edge

Data Density   and Throughput

Number of data points,   full wafer map

>200,000 for 200mm   wafer

System throughput – 2mm   edge exclusion

System throughput – E   emulation mode, 3mm edge exclusion

56 200mm wafers per hour with full wafer mapping

90+ 200mm wafers per hour with full wafer mapping

Option –   Resistivity Measurement

Low range module –   measurement range

0.001 – 0.999 ohm-cm

High range module –   measurement range

0.2 – 199.9 ohm-cm

Resistivity Gage   configuration – low, high or both

P/N Type sensor -   optional

Non-contact detection of   wafer P type or N type

Wafer   Sorting and Cassettes

Sorting criteria

Configurable sorting,   numerous binning options

Number of Cassettes

5 cassettes standard - 2   in, 3 out typical

Wafer   Measurements

Wafer Thickness

Full wafer scan, 5 point   or center point

Shape

Bow/Warp/SORI using   3-Point or Best Fit references

Global Flatness

SEMI GBIR, TIR, FPD,   FPD%, 5 Point TTV

Site Flatness

SFQR/SFQD, SBIR/SBID and   all SEMI M1 standards with 8-30mm sites size and variable offsets

Options

Resistivity gage (low   high or both), P/N type sensor, edge grip end effectors and edge grip   pre-aligner, SECS/GEM Interface, optical annealing for very high res wafers

Machine   Certifications

SEMI S2, CE