Reduce 200mm wafer measurement time – industry leading 1.25x higher throughput – 56 wafers per hour in E++ equivalent mode, with full wafer mapping and 2mm edge exclusion
90+ wafers per hour in E emulation mode, with 3mm edge exclusion
Nanometer resolution, dual probe MicroSense capacitive measurement system for high sensitivity and high repeatability measurements in compliance with SEMI standards
Measures over 200,000 data points per 200mm wafer
Fully automated in machine Auto-Calibration – more wafers measured each shift
Designed for reliability and long term support - UltraMap has a modern, high reliability system design with direct drive precision air bearing r-theta wafer stage and software running on Windows computer.
Non-contact 200 mm precision air bearing r-theta stage
Dual arm Robot and pre-aligner
Kinematic 3 point wafer holder
Cassette sorting; 5 cassettes (2 in, 3 out)
Integrated light curtain safety system
Optional SECS/GEM interface
Optional Resistivity, Low or High or both
Optional P/N type sensor
Dual sided SEMI standard capacitance measurement
2mm edge exclusion
Completely programmable measurement path, including legacy system emulation. 1.9mm standard measurement ring spacing.
Accuracy | Repeatability (1 sigma) | Absolute Range | |
Thickness | ±0.25 μm | 0.06 μm | Nominal ±150 μm |
Global Flatness | ±0.06 μm | 0.02 μm | |
Site Flatness | ±0.06 μm | 90% of sites: 0.011 μm | |
10% of sites: 0.025 μm | |||
Shape (Bow/Warp) | ±(1.5 + 3% of reading) μm | ±(0.5 + 1% of reading) μm | ±150 μm |
Wafer Properties | |
Material | Silicon wafer - etched, lapped or polished |
Wafer diameters | 200mm diameter (option for 150mm) |
Wafer thickness | 300μm to 1200μm |
Notches, Flats (Primary/Secondary | Up to 2 notch or flat per SEMI standard |
Edge Exclusion | Adjustable; up to 2mm from wafer edge |
Data Density and Throughput | |
Number of data points, full wafer map | >200,000 for 200mm wafer |
System throughput – 2mm edge exclusion System throughput – E emulation mode, 3mm edge exclusion | 56 200mm wafers per hour with full wafer mapping 90+ 200mm wafers per hour with full wafer mapping |
Option – Resistivity Measurement | |
Low range module – measurement range | 0.001 – 0.999 ohm-cm |
High range module – measurement range | 0.2 – 199.9 ohm-cm |
Resistivity Gage configuration – low, high or both | |
P/N Type sensor - optional | Non-contact detection of wafer P type or N type |
Wafer Sorting and Cassettes | |
Sorting criteria | Configurable sorting, numerous binning options |
Number of Cassettes | 5 cassettes standard - 2 in, 3 out typical |
Wafer Measurements | |
Wafer Thickness | Full wafer scan, 5 point or center point |
Shape | Bow/Warp/SORI using 3-Point or Best Fit references |
Global Flatness | SEMI GBIR, TIR, FPD, FPD%, 5 Point TTV |
Site Flatness | SFQR/SFQD, SBIR/SBID and all SEMI M1 standards with 8-30mm sites size and variable offsets |
Options | |
Resistivity gage (low high or both), P/N type sensor, edge grip end effectors and edge grip pre-aligner, SECS/GEM Interface, optical annealing for very high res wafers | |
Machine Certifications | SEMI S2, CE |