MaxTC Power Plus is designed with high power and flexibility to support a variety of different packages and interfaces. The system allows for forcing temperature across a wide range of high power device sizes and types, whether socketed or soldered to board. The Max TC Power Plus unit uses state of the art thermal conduction techonology to stimulate DUTs to the desired temperature precisely and consistently by direct contact with a powerful thermal head.
Cooling Power -55°C@400W (steady state)
Ramp Rate up to 75°C/Min
Temperature stability: ±0.5°C
Temperature range -75⁰C to 200⁰C
Minor temperature overshooting at high power spikes
Fast recovery time at high power spikes
Replace LN2, Thermostream, Chillers and Chambers
Remotely controlled via an Ethernet
