Industry's highest level inspection speed
Equipped with the industry's highest 25-megapixel camera module. Can have69mmx69mm wide field of view.
Coexistence via built-in GPU
High-speed processing, M-type circuit board can be inspected in 22 secondscheck
High-precision quantification technology
Built-in IPC610 international standard measurement method.
High quality without operator's special experience requirementsan examination
2D + 3D hybrid inspection
In addition to quantitative test data obtained in 3D,
Tin judging machine learning logic can effectively check the state of solder,
Various defects in the production of component differences, foreign objects, etc.
Equipment Specifications
Circuit board size 50 × 50㎜ to 510 × 680㎜ (standard)
Thickness range 0.4 to 6.0㎜
Transport standard Effective space above and below Above: 50㎜, Below: 50 : Above hand
Conveying direction left → right or right → left
Inspection items Multi-tin, low-tin, pin warpage, component warpage, component inspection, polarity, comprehensive foreign matter, text inspection
Minimum inspectable component 0402 (solder condition inspection is 0603)
Processing capacity 3,600㎜2 / sec (3D + 2D standard)
System specifications 4-directional projector
Lighting system: 25MP camera + telecentric lens
Camera components
Resolution 15μm
Operating specifications Touch panel, keyboard
Dimensions W1,070㎜ × D1,550㎜ × H1,500㎜ (except signal)
Weight 800 ㎏
Compressed air
Power supply voltage: Single-phase AC point 200-240V, 2KVA