AOI

  • Product No:NVI-G300
  • Manufacturer:Nagoya

Industry's highest level inspection speed

Equipped with the industry's highest 25-megapixel camera module. Can have69mmx69mm wide field of view. 

Coexistence via built-in GPU

High-speed processing, M-type circuit board can be inspected in 22 secondscheck

High-precision quantification technology

Built-in IPC610 international standard measurement method.

High quality without operator's special experience requirementsan examination

2D + 3D hybrid inspection

In addition to quantitative test data obtained in 3D,

Tin judging machine learning logic can effectively check the state of solder,

Various defects in the production of component differences, foreign objects, etc.


Equipment Specifications

Circuit board size 50 × 50㎜ to 510 × 680㎜ (standard)

Thickness range 0.4 to 6.0㎜

Transport standard Effective space above and below Above: 50㎜, Below: 50 : Above hand

Conveying direction left → right or right → left

Inspection items Multi-tin, low-tin, pin warpage, component warpage, component inspection, polarity, comprehensive foreign matter, text inspection

Minimum inspectable component 0402 (solder condition inspection is 0603)

Processing capacity 3,600㎜2 / sec (3D + 2D standard)

System specifications 4-directional projector

Lighting system: 25MP camera + telecentric lens

Camera components

Resolution 15μm

Operating specifications Touch panel, keyboard

Dimensions W1,070㎜ × D1,550㎜ × H1,500㎜ (except signal)

Weight 800 ㎏

Compressed air

Power supply voltage: Single-phase AC point 200-240V, 2KVA