SPI

  • Product No:NVI-S300
  • Manufacturer:Nagoya

No dead angle test for 2D + 3D hybrid double-sided laser test mechanism

Can check any printing defects

High-precision detection

18um standard resolution (12um resolution optional)

High-speed inspection

Equipped with a high frame rate camera, the performance is greatly improved

Compared with the previous generation model, the M circuit board is shortened by 13.1 seconds, and the L circuit board is shortened by 26.1 seconds. Inspection time (including delivery time)


Checkout specifications

Circuit board size 50 × 50mm ~ 510 × 460mm (standard)

Circuit board thickness 0.3 ~ 4.0mm

Conveying reference Either the operating surface or the inner surface (set at shipment

Conveying direction from left to right or right to left (set at shipment)

Conveying height 900 ± 25mm

Inspection items Less tin, more tin, overflow, center of gravity shift, bridge connection, volume, cross-sectional area, area of protrusion, average height, peak height

Minimum abutment distance 0.08mmThe difference in printing height between abutment parts is less than 50um

Minimum detected component pin spacing 0.15mm, CSP, 0402 components (unit: mm)

Processing capacity 7000mm2 / sec (standard)

System specifications

Camera resolution Standard high-speed 18um pixels, high-precision 9um pixels (software switching)

Lighting 2D: 360-degree panoramic 2-segment RGB / 3D: linear lighting

Check the program to make gebe data conversion

Power supply AC100V10% 1.5k single phase (50 / 60H)

Compressed air 0.4-0.5mpa10NI / min

Equipment size W1100 × D1200 × H1550mm (excluding signal light)

Weight about 400kg

Optional features

① Correspond to L = 750mm (corresponds to 2 division inspection)

② 1D, 2D bar code correspondence

③ Statistical analysis software SPC

④ Offline programming