Full Automatic Wafer Thickness measurement system

  • Product No:UltraMap-300-WL
  • Manufacturer:MicroSense, LLC

MicroSense UMA-200-WL measurement systems provides precise wafer measurements using chromatic confocal optical sensors.

MicroSense white light systems measure a wide range of wafer materials including Si, SiC, Sapphire, GaS, GaN, Glass, Quartz and many other transparent and non transparent substrates.

MicroSense White Light systems are available in both a low cost bench top system as well as a fully automated sorting configuration with up to six cassettes.

Measurement Technology

A white light source is used to illuminate the surface of a part. The light travels via fiber from the control unit to an optical probe which separates the light into different focal distances as a function of wavelength, as shown in the graph. Based on the wavelength of the reflected light, a very precise distance measurement can be taken. The optical probe determines the measuring range. Because of the high numerical aperture of the probes and dynamic range of the sensor, it is possible to measure on a wide range of materials.

  • Non-contact dual probe wafer measurement system.

  • Dual White Light Chromatic Confocal Probes.

  • Dual probe system with White Light Chromatic coding.

  • Measures bare and patterned wafers, polished, non-polished, transparent and non-transparent.

  • Automated X-Y air bearing stage with X-Y encoders and a wide range of available wafer adapters.

  • Thickness measurement range for wafers 10μm – 3mm.

  • Store hundreds of recipes for each wafer size. User-generated measurement patterns.

  • Results available in table format or wafer mapping software for 2D and 3D display.

  • Vibration resistant granite block measurement base.

  • Integrated Prealigner for 4” through 8”.

  • Simple, menu driven Windows W7 user interface.

  • Standard operating software package for Thickness, TTV, LTV, TIR, Sori, Taper, Bow and Warp, and a host of Semi-defined parameters.


Measurement ParametersAccuracy

Repeatability One Sigma

Resolution

Thickness: Flat Wafers (<500um Bow)

Thickness: Center, Minimum, Maximum, Average

0.5μm+/- 0.15 μm0.1μm

Thickness: Bow > 500um and < 1000um

Thickness: Center, Minimum, Maximum, Average

1.5μm+/- 0.25 μm0.1μm
Bow/Warp1μm + 0.5% range+/- 1 μm0.1μm




Wafer   Specifications System Configuration Features
Wafer   Size:
    50mm to 200mm, Custom
Diameter Tolerance:
    +0.2mm, -0.5mm
Thickness Range:
    10μm - 3000μm
Surfaces: Sawn, Lapped, Polished
Sample Positioning:

    Precision Air Bearing

Auto Probe Positioning:

    Optional
Pre-aligner: Optional
OCR Reader: Optional
SECS/GEM: Optional
Wafer Handling:
Manual and Robotic 100μm and above High-Bow up to 5mm
Cassette Stations: Up to 6

Calibration: Automated 

Reliability (MTBF): 10,000 h