MATRIX® PVD for Semiconductor Advanced Packaging-In-line modular etch and deposition system. This platform is recommended for barrier and seed layers on substrates and devices for RDL, UBM, TGV/TSV interposers in Fan Out Applications (FOPLP and FOWLP), 2.5D/3D ICs, Cu Pillar Bumps and 3DWLP. Configurable for R&D to Pilot to High Volume Manufacturing with Degas, Ion Beam Etch (IBE) pre-clean and PVD Ti and Cu.
· Carrier-based design allows an effortless migration path for OSATs to move between wafer-level and panel-level processing; no process chamber modifications necessary.
· Superior process metrics including high film uniformity over large areas and industry-leading Rc.
· Significantly faster throughput.
· Horizontal processing of substrates up to 650mm x 650mm
· The MATRIX produces the lowest Rc of <0.5mOhm
· The MATRIX has the highest throughput: 450 WPH for 200mm wafers; 200 WPH for 300mm wafers; 50 PPH for panels up to 650mm x 650mm
