Fully Auto Wafer Inspection

  • Product No:WI300
  • Manufacturer:Micro Modular System Sdn. Bhd.

Automation wafer Inspection Machine is designed to deliver utmost flexibility to support top vision inspection for fabricated components on wafer. Including High Resolution Camera, Selection from 5MP to 65MP mono/ color camera imaging technology, Real Time Wafer Map Display, Wafer Die and Wire Bond Inspection, defect size minimum detectable down to 5 μm x 5 μm. Warpage detection up to 2mm by confocal displacement sensor.

Products: Wafer Ring(4"-6" inch), PCBA tiles.

Inspection criteria: Wire Bond and Cosmetic.

Input/Output: Tiles, Wafer, Wafer rings.

UPH: Up to 40K, depending on product site/ geometry and inspection criteria.