Automation wafer Inspection Machine is designed to deliver utmost flexibility to support top vision inspection for fabricated components on wafer. Including High Resolution Camera, Selection from 5MP to 65MP mono/ color camera imaging technology, Real Time Wafer Map Display, Wafer Die and Wire Bond Inspection, defect size minimum detectable down to 5 μm x 5 μm. Warpage detection up to 2mm by confocal displacementsensor.
Products: Wafer Ring(4"-6" inch), PCBA tiles.
Inspection criteria: Wire Bond and Cosmetic.
Input/Output: Tiles, Wafer, Wafer rings.
UPH: Up to 40K, depending on product site/ geometry and inspection criteria.