Semi Auto Wafer Inspection is designed to deliver the utmost flexibility to support top vision inspection for fabricated components on wafer. Including High Resolution Camera, Selection from 5MP to 65MP mono/ color camera imaging technology, Real Time Wafer Map Display, Wafer Die and Wire Bond Inspection, defect size minimum detectable down to 5 μm x 5 μm. Warpage detection up to 2mm by confocal displacement
sensor.
Products: 6" bare wafer or 8" wafer ring
Inspection criteria: Cosmetic.
Input/Output: Manual
UPH: 10K, depending on product site/ geometry and inspection criteria.