Machining of Kureha PEEK ESD Grades

A.

1. Cutting tool Since Krefine PEEK ESD grades are filled with carbon materials, tool abrasion should be taken into consideration. Abrasion resistant steel is desirable for tool, hard metal must be used. High speed Titanium coating is recommended. 2. Drilling Revolution speed is one of the most important factors for drilling. Suitable revolution speed can give high precision machining without flash. The normal revolution speed is from 5000 tó 10000 r.p.m and the drill movement speed is about from 50 to 150mm/min. 3. Cutting speed When machining Krefine PEEK ESD grades, the cutting speed should be lowered (200mm/min). 4.Example of drilling Table 1 shows the example of drilling conditions for 0.56mm hole diameter and 0.8mm between center ofholes applicable to Krefine PEEK ESD grade, EKH-SS11. Figure 1 shows picture after drilling.

LEMSYS Release Fully Automated Test Line to ramp up Power Electronics Manufacturing

A.

Geneva, Switzerland, 27th November 2014 – LEMSYS SA, the leading global provider of engineered measurement solutions for the power semiconductor industry, announced that it has upgraded a major IGBT and MOSFET production facility in China with a fully automated test line for high voltage Direct Bond Copper (DBC) substrates. LEMSYS Automated Test Line, can conduct quality testing and sorting of components at a rate of 300 parts/hour meeting annual production output targets of more than 1 Million pieces. These are pretty impressive numbers when comparedwithproduction plants where the quality test checks are carried out manually by at least two operators working full time, hardly exceeding an annual production output of 200K units. Mr. Giuseppe Santandrea, member of theExecutive Committee of LEMSYS,commented: “We expanded our IGBT and MOSFET Modular equipment family range for Static and Dynamic measuring with the addition of tailored and automated test linesfromwafer level to DBCsubstr