MicroSense’s UltraMap 200-BP measurement system utilizes MicroSense proprietary backpressure, auto positioning probe technology to measure wafers of any material up to 200mm in diameter.
The system can measure wafers ranging from 50um to 3mm thick without any mechanical adjustment of the probe positions. Additionally, the system can measure wafers with high bow and warp.
The UltraMap is available as a standalone (UMS200-BP) semi-automated measurement system or as a fully automated system (UMA200-BP) with wafer handling robot and multiple input output cassettes.
Wide Measurement Range
50μm to 20mm thickness
Warp range 100μm
Precise, Accurate Measurements
0.5μm absolute accuracy
Available verification standards
Available reference standards for high-thickness samples
Production Friendly
Sawn, Lapped and Polished wafers
Non clean room environment
Easy data export
| Measurement Parameters | Accuracy | Repeatability One Sigma | Display Resolution |
| Thickness: Flat Wafers (<100um Bow) Thickness: Center, Minimum, Maximum, Average | 0.5 μm | ± 0.015 μm | 0.1um |
| Wafer Specifications | System Configuration |
| Wafer Size: Any, including, and Custom and Saw-frame mounted. Wafer Thickness Range: 100μm - 3000μm Surfaces: Wafers - As Sawn, Lapped, Polished | Wafer Handling: Manual Wafer Measurement Location Positioning: Manual Calibration: Automated Wafer Measurement: Automated Reliability (MTBF): 50,000 Samples |
| Facilities Requirements |
| Dimensions: 18” width, 16” depth, 20” height. Separate PC, Monitor, Keyboard, and Mouse Weight: 100lbs Voltage: 110V for US, 200 – 250V options available. Single phase grounded polarized outlet required. Frequency: 50/60 Hz Current: 2A nominal, 10A peak Circuit Breaker: 10A UL489A certified breaker Air supply: Clean dry air or Nitrogen 40 – 60 PSI Fittings: ¼” compression fitting |
