FLA-200 is a Wafer flatness measurement system by Napson.
Measures Thickness, TTV, Bow, Warp and site and global Flatness (ASTM compliance)
Measures all materials including Si, GaAs, Ge, InP, SiC
Full 500 micron thickness measurement range without re-calibration
2-D /3-D Mapping software
Sample sizes
3~8 inch
Measuring range
Thickness: 200 –1200μm
Bow : +/-350μm
Warp: 350μm