The new OAI Model 800E front and backside, semi-automatic mask aligner system offers advanced features and specifications found most often in costly automated production mask aligners. With the development of this new mask aligner, OAI meets the growing challenge of a dynamic semiconductor and MEMS market with a new class of mask aligners that are engineered for R&D and low volume production.
Built on OAI’s proven modular platform, the Model 800E is an enhanced, high-performance, high-resolution lithography system which delivers a level of performance that is offered at an extremely compelling price point. The aligner system features OAI’s Advanced Beam Optics which delivers exceptional uniformity. Upgradable using OAI’s Precision Lithography Modules, the Model 800E is a highly versatile tool in the lab or in low-volume production. The Model 800E utilizes a Windows 7 PC control platform with extensive recipe storage capacity. The system also comes with joystick-controlled alignment and optics stages, and can be configured with non-contact, 3-point wedge effect correction and auto-align capability. These combined features are typically found in automated production mask aligner systems but are now available on the Model 800E at a more affordable price.
The Model 800E is unique owing to the inclusion of advanced features which are found in the OAI Model 6000 production mask aligner tool. By utilizing the proven OAI modular mask aligner platform, we are able to adopt technology from our more advanced tools to produce a powerful system at a more affordable price.
Standard front-side mask aligner features include: Dual 1MP resolution GIGE CCD cameras, motorized joystick, vacuum, hard soft & proximity exposure modes and Auto Wedge Effect Compensation. Standard backside features include all front-side features plus two additional cameras, digital zoom and motorized backside optics focus.
Semi-Auto Double Side Mask Aligner
Wave length220nm-405nm
4-8inch
UV&LED Light Source
Proximity accuracy 3um
Soft contact accuracy2um
Hard contact accuracy 1um
Vacuum contact accuracy 0.8um
Autocompensation,Auto Z axis move
Can be configured as Nano Imprint tool for NIL
Enhanced Performance:
Dual 1 MP resolution GigE CCD cameras with continuous zoom optics for better alignment accuracy
Objective separation 44-200mm
Optical magnification 70x – 400x
Large optics Y travel for flat alignment
Enhanced digital image capture and blended image overlay resulting in better front to backside overlay accuracy
Computer controlled illumination for more repeatable alignment
Auto-alignment utilizing the latest pattern recognition technology from Cognex
Includes CD Measurement capability
Backside alignment with optical backside magnification 180x, digital zoom and motorized auto-focus
Auto Wedge Effect compensation including 3 pt wedge- effect leveling and automated gap setting
Joystick control of alignment tooling and optics
OTHER CAPABILITIES:
IR backside added to 4 camera backside system
Nano Imprint Lithography (NIL) Module and starter kit can be added
Contact Liquid Photopolymer Process Module for Microfluidics
OTHER FEATURES:
Easy to upgrade from Front to Backside Alignment
Easy to enhance your system with OAI’s precision Lithography Modules
Easy to operate and maintain
Ergonomic design for User
Front/Backside Mask Aligner System
Mask rotation Not required (camera compensation front/back)
Mask size Up to 9”x9”
Mask loading Vacuum and mechanical clamp
Mask/substrate separation Manual, user definable, infinitely variable
Mask/substrate pressure User definable
Chuck motion control X,Y,Z & Theta (differential micron)
Exposure gap 0-3000µm
Gap adjustment 1µm
Mechanical resolution 1.5µm
X, Y travel ±10mm
Theta travel ±4°
Leveling Wedge-compensation system
Overlay accuracy Front to back <2µm (3s) - Top side to 0.5µm
Substrate size To 200mm square
Printing modes Proximity, Soft, Hard & Vacuum Contact
Printing resolution Soft contact - 2µm
Hard Contact Submicron
Exposure time 1-3,200 in 0.1 second increments