No dead angle test for 2D + 3D hybrid double-sided laser test mechanism
Can check any printing defects
High-precision detection
18um standard resolution (12um resolution optional)
High-speed inspection
Equipped with a high frame rate camera, the performance is greatly improved
Compared with the previous generation model, the M circuit board is shortened by 13.1 seconds, and the L circuit board is shortened by 26.1 seconds. Inspection time (including delivery time)
Checkout specifications
Circuit board size 50 × 50mm ~ 510 × 460mm (standard)
Circuit board thickness 0.3 ~ 4.0mm
Conveying reference Either the operating surface or the inner surface (set at shipment
Conveying direction from left to right or right to left (set at shipment)
Conveying height 900 ± 25mm
Inspection items Less tin, more tin, overflow, center of gravity shift, bridge connection, volume, cross-sectional area, area of protrusion, average height, peak height
Minimum abutment distance 0.08mmThe difference in printing height between abutment parts is less than 50um
Minimum detected component pin spacing 0.15mm, CSP, 0402 components (unit: mm)
Processing capacity 7000mm2 / sec (standard)
System specifications
Camera resolution Standard high-speed 18um pixels, high-precision 9um pixels (software switching)
Lighting 2D: 360-degree panoramic 2-segment RGB / 3D: linear lighting
Check the program to make gebe data conversion
Power supply AC100V10% 1.5k single phase (50 / 60H)
Compressed air 0.4-0.5mpa10NI / min
Equipment size W1100 × D1200 × H1550mm (excluding signal light)
Weight about 400kg
Optional features
① Correspond to L = 750mm (corresponds to 2 division inspection)
② 1D, 2D bar code correspondence
③ Statistical analysis software SPC
④ Offline programming