Intevac is a leader in the design and manufacturing of high-productivity, thin-film and related vacuum processing equipment. Our advanced processing capabilities and production-proven platforms are developed for high-volume manufacturing of substrates with precise thin-film properties, for markets including hard disk drive media, display cover panel, solar photovoltaic, semiconductor advanced packaging (FOPLP and FOELP), LED/Micro LED and others.
Intevac Products and Markets Served
MATRIX™ PVD - In-line modular etch and deposition system, horizontal processing of substrates up to 650mm x 650mm, double sided. Custom configurations are possible. This platform provides processing of substrates and devices for multiple applications and markets.
· Semiconductor advanced packaging: R&D to Pilot to High Volume Manufacturing configurations that include: Degas, Ion Beam Etch (IBE) pre-clean and PVD Ti and Cu to create the barrier and seed layers for RDL, UBM and TGV/TSV interposers in Fan Out Applications (PLP and WLP); 2.5D/3D ICs; Cu Pillar Bumps and 3DWLP. The MATRIX provides the lowest Rc of <0.5mOhm, the highest throughput: 60PPH (full size Panels up to 650mm x 650mm) and the lowest CoO.
· Solar: The Intevac Matrix® platform’s high-speed transport technology improves productivity to over 3,000 wafers per hour, depending on the application. The platform’s overhead carrier return greatly minimizes the system’s overall footprint. Multiple load locks allow independent control of process chambers.
VERTEX MARATHON™ - Combination in-line and batch etch and deposition system, vertical processing of substrates up to 400mmm x 400mm. Custom configurations are possible. This platform provides processing of substrates and devices for multiple applications and markets.
· Protective coating for display glass and other surface:
DiamondClad™ is Intevac’s Diamond-Like Carbon (DLC) that is a non-hydrogenated ta-C with a high % of sp3 bonding.
This film provides protection against scratching, abrasion and wear for optical and other surfaces. Mohs 6 to 6+, Hardness 25 GPa and higher. Transmission up to 95%. DiamondClad provides excellent adhesion with oleophobic and hydrophobic coatings, showing much greater durability than un-coated glass. This film has applications in screen protectors, smartphone and wearable display cover glass and case components, as well as metal and other surface for scratch and environmental protection of metal and other surfaces.
· Decorative coatings (NCVM) for mobile device back covers: Optically-engineered, multi-layer film stacks unlock a virtually limitless range of colors, gradients and patterned effects for back cover glass. Intevac’s Non-Conductive Vacuum Metallization (NCVM) technologies expand the design freedom of the next generation of smartphones.
ENERGi ® - In-line ion implant system, horizontal processing of substrates up to 166mm wide. For other sizes, please inquire. This platform is best suited for Bifacial, n-TOPCON, IBC and PERC (selective emitter) solar cell application. The system has been proven in production to provide absolute >1% improvement in cell efficiency and best CoO. This platform finds it application for：
· Blanket n- and p-type doping.
· Patterned n- and p-type doping.
· ENERGi ion implant has a special advantage over other methods for Boron Selective Emitter structures.
